eN-GXSOC Boxed

Good heat dissipation due to the completely aluminum housing. Small form factor of 119x103x46mm.

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Fanless Design

Heat dissipation plays a crucial role if the eN-GXSOC is to achieve the full performance. This fanless aluminum housing is perfect for absorbing and dissipating heat – so that the AMD embedded G-series processor is guaranteed to work at maximum performance.

High expandability for peripheral devices

Thanks to a lot of dedicated I / O connections, the embedded Boxed Computer can be easily expanded with other wired peripheral devices.

OUR BUILDING BLOCK

eN-GXSOC

Very compact and highly integrated single board computer with AMD® Embedded G-series SOC, Embedded NUC™ Type 2 “Connectivity” modul 101.6 x 101.6 (4” x 4”)

Highlights:

The eN-GXSOC is a board that provide a relevant range of integrated modern interfaces and functionalities. It is available for purchase for many years with flexible logistics. The embedded NUC™ eN-GXSOC Single-Board-Computer is equipped with an embedded “Steppe Eagle” G-Series SOC platform from AMD® ranging from dual-core GX-212JC with 6W up to quad-core GX-412HC with 7W thermal design power (TDP). These processor platform is a high-performance, low-power-System-on-Chip (SOC) design with integrated powerful graphics core. They provide the appropriate performance for playing Video material in 4K resolution. Even a color depth of 10 bit can easily been activated in the operating systems graphics card driver (Catalyst).The integrated Radeon® graphics supports two independent displays. The connection is established via DisplayPort++, eDP on I-PEX or mDP++ and dual channel 24-Bit LVDS.

The eN-GXSOC is entirely manufactured in Germany. Our EMS partner Ihlemann AG guarantees a high-end quality printed circuit board assembly.

Details:

  • Very compact and highly integrated single board computer with AMD® Embedded G-series SOC
  • Embedded NUC™ Type 2 “Connectivity” modul 101.6 x 101.6 (4” x 4”)
  • Industrial range power supply 12 – 36 VDC
  • Supports up to 24-Bit dual channel LVDS, DisplayPort++
  • embedded DisplayPort with I-PEX for display connectivity
  • Modular LCD Led backlight power solution
  • USB 3.0 Connectivity
  • USB to CAN 2.0 Interface for communicating with other CAN bus systems.

Processor

up to AMD® Embedded G-Series GX-412HC, Quad Core @ 1.2 GHz, 2MB Cache, 7W TPD

Memory

up to 4GB LPDDDR3 SDRAM onboard

Graphics

AMD Radeon R3E, Basefrequency 300MHz, 2 supported displays

Video Interface

DP++ and optional mDP++ or embedded DP on I-PEX connector and 2 CH LVDS 24Bit

Mass Storage

1x SATA connector, optional eMMC drive soldered onboard and mSATA Flash-Disk

Networking

Gigabit LAN, I211 10/100/1000 BASE-T

USB

4x USB2.0 Host ports on Type-A sockets, 2x USB3.0 Host ports on Type-A sockets

PCI-E

1x mini PCI-e

Audio

I2S Audio InterfaceAudio available on DP++, mDP++, HD Audio Codec LineOut and MicIn on internal pin header

Serial Ports

1x RS232 UART on LPC-Bus, with external circuit board 4x RS232

Other Interfaces

SPI-Flash on internal pin connector CAN-Bus-Driver with external circuit board

Power Supply

12VDC-36VDC & RTC Battery

Operating System

Support for Microsoft® Windows, Linux and other real-time OS

Dimensions

101.6 x 101.6 (4” x 4”)

Operating Tempature

0°C ÷ +60°C

Functional Diagram